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  Új Válasz 2023-11-17 17:31:28 #9191

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  válasz hokuszpk #9190 üzenetére

  > Samunak van chipletfelheggeszto technologiaja,
  
  packaging?
  le vannak maradva, de szeretnének

  https://www.businesskorea.co.kr/news/articleView.html?idxno=117558
  """
  (2023.07.03)
  Samsung has also launched an all-out effort to develop advanced packaging technology that will take chip performance to the next level. At the Samsung Foundry Forum 2023 held on June 27, Samsung Electronics announced an all-out packaging war with TSMC, saying that it will not only advance its packaging technology but also grow related ecosystems. To this end, the Korean semiconductor giant even introduced the concept of a one-stop packaging service. It plans to provide customized packaging services for customers that want to improve the performance of their chips. In the long term, it will create a new line dedicated to packaging.
  
  In order to overtake TSMC’s CoWoS, Samsung is also developing a more advanced concept of I-cube and X-cube packaging technologies. In particular, the Korean chipmaker is reportedly focusing its research on three-dimensional (3D) packaging in which multiple chips are stacked vertically to boost performance. “Samsung is preparing a more advanced way, the three-dimensional packaging of semiconductors,” a semiconductor industry insider said. “Soon there will be a head-on collision between Samsung and TSMC in packaging.”
  
  출처 : Businesskorea(https://www.businesskorea.co.kr)
  """

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