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  • janpotocki

    senior tag

    válasz borely #62 üzenetére

    A TDP valóban nem a csúcsfogyasztása a procinak, hanem azt adja meg, hogy normális körülmények között, normális szoftverekkel, normális hűtéssel mennyi a tartható maximum. A normális esetek közül a legrosszabb esettel számolnak persze, de kizárják a hibás vagy a CPU-t rendellenes módon igénybe vevő kódokat.

    Thermal Design Power: The maximum amount of heat which a thermal solution must be able to dissipate from the processor so that the processor will operate under normal operating conditions.

    Thermal Design Power: a power dissipation target based on worst-case applications. Thermal solutions should be designed to dissipate the thermal design power.

    Thermal specifications for the Pentium 4 processor on 90 nm process is the thermal profile. The thermal profile defines maximum case temperature as a function of power dissipated. The maximum case temperature for the maximum thermal design power (TDP) is the end point of the thermal profile.

    The processor thermal design power (TDP) is based on measurements of processor power consumption while running various high-power applications. This data is used to determine those applications that are interesting from a power perspective. These applications are then evaluated in a controlled thermal environment to determine their sensitivity to activation of the thermal control circuit. This data is used to derive the TDP targets published in the processor datasheet.

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